Exclusive

Publication

Byline

Location

TSMC N3 tightens on AI demand; Arizona second fab 3nm volume production in 2H27, Kumamoto in 2028

India, April 22 -- TSMC held its earnings call, with tightness at its 3nm node coming into focus as the foundry giant outlines new plans to expand N3 capacity. Its Chairman and CEO C.C. Wei says that,... Read More


Implementation dialogue on the EU Chips Act

India, April 22 -- Henna Virkkunen, Executive VP, Tech Sovereignty, Security and Democracy, EU, chaired an implementation dialogue on the Chips Act that brought together a number of industry leaders a... Read More


Siemens accelerates AI chip verification to trillion‑cycle scale with NVIDIA technology

India, April 22 -- Siemens, in close collaboration with NVIDIA, announced that its Veloce proFPGA CS hardware-assisted verification and validation system is empowering designers and system architects ... Read More


Groundbreaking of India's first advanced 3D semiconductor packaging unit in Odisha

India, April 21 -- In a defining moment for India's semiconductor ambitions and Odisha's emergence as a future-ready technology destination, the foundation stone for the country's first advanced 3D ch... Read More


Xebia powers scalable enterprise AI with NVIDIA, and Anthropic

India, April 21 -- Xebia, a global AI-first, digital transformation, and engineering partner, announced strategic partnerships with NVIDIA, and Anthropic reinforcing its commitment to advancing enterp... Read More


Cadence and Google to scale AI-driven chip design with ChipStack AI super-agent on Google Cloud

India, April 21 -- Cadence, an industry leader in AI-driven computational software for semiconductor and system design, has announced a strategic collaboration with Google to optimize the Cadence Chip... Read More


PIC and mix: How quantum tech is shaking up photonics industry?

India, April 21 -- Photonic integrated circuits (PICs) are optical systems fabricated on semiconductor wafers, allowing complex optical processes to be performed on a chip-scale device. PICs have enab... Read More


Qualcomm and Snap expand strategic collaboration to advance intelligent computing experiences on specs

India, April 21 -- Qualcomm Technologies Inc. and Specs Inc., a Snap subsidiary, announced a multi-year strategic agreement to power future generations of Specs with Qualcomm Technologies' industry-le... Read More


China's humanoid robot output to surge 94% in 2026; Unitree and AgiBot to capture nearly 80% market share

India, April 21 -- TrendForce's latest in-depth report on humanoid robots reveals that the global industry is set to enter a critical phase of commercialization in the second half of 2026. In China, v... Read More


Co-packaged optics: Powering the next wave of AI infrastructures

India, April 20 -- Artificial intelligence (AI) is driving unprecedented growth in computing power and data movement. However, memory and interconnect bandwidth are struggling to keep pace, creating m... Read More